Modeling and Simulation of Substrate Coupling for Accurate Circuit Simaultion
講演者:
Zuochang Ye Institute of Microelectronics
Tsinghua University Ph.D student
Abstract:
The integration of digital and RF circuits on a single die leads
to several design problems. One major issue is the effect of substrate
bounce or substrate noise. At present, Very little software and models
support to predict the effects. This talk will present our latest and
on-going research on this issue, which mainly focuses on numerical
algorithms and compact model for substrate coupling.
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