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Development of COE

Education Implementation Program

Extension of the worldwide top-level basic-technologies.
Accelerated fusion of the research activities of the three fields.
Young researcherfs proposals: Start of 2 projects on devices and modeling.

Merging the cooperative research between the fields.
Promotion of the research on wireless interconnects between chips.
Young researcherfs proposals:
2 additional projects between the device and circuit/system fields.

Upgrading of the technology level in the optical-interconnect
and functional-memory fields to introduce them

Highly efficient methods for integrated device and circuit design.
Basic 3D system design technology
for integrated circuit and electrical/optical integration

Establishment of the basic technologies on the research-fields
Organizational fusion of the hard/software fields
for nanodevice integration and high-level recognition.